PHENOLIC NOVOLAK RESIN, CURING AGENT FOR SEALING MATERIAL AND CURED PRODUCT FOR SEALING SEMICONDUCTOR

摘要

PROBLEM TO BE SOLVED: To provide a new phenolic novolak resin exhibiting excellent fluidity, moisture absorbing characteristics, flexibility and solder heat resistance as a curing agent for an epoxy resin and to provide a cured product for sealing semiconductors. SOLUTION: The phenolic novolak resin is characterized in that a resin skeleton component contains bisphenol A and a cross-linking group contains a xylylene skeleton group. The resin can be utilized as the cured product for sealing the semiconductors. In the phenolic novolak resin, the xylylene skeleton of the cross-linking group is preferably obtained from a p-xylylene dihalide or a p-xylylene dialkyl ether. The phenolic novolak resin is more preferably prepared by reacting the bisphenol A with the p-xylylene dihalide or p-xylylene dialkyl ether in 1.2-10 molar ratio of the bisphenol A/p-xylylene dihalide or p-xylylene dialkyl ether. COPYRIGHT: (C)2004,JPO