| 摘要 |
<P>PROBLEM TO BE SOLVED: To perform the solder connection of an IC chip with a board at a low price, even if the pitch of terminals provide is intended, to narrow it and the feeding power of a terminal is intended to increase it in the IC chip, when mounting the IC chip on the board by solders via two or more kinds of plural terminals, having different connecting areas from each other. <P>SOLUTION: An IC chip 10 has a plurality of terminals 12a, 12b having different connecting areas from each other, and a board 20 has a plurality of opposite terminals 22a, 22b to the terminals of the IC chip 10. With respect to the terminal 22b of the terminals of the board 20 which has a comparably large connecting area, a solder paste 30a is fed to the terminal 22b on the side of the board 20, and with respect to the terminal 22a which has a comparably small connecting area, a solder 30 is fed to the opposite terminal 12a of the side of the IC chip 10 to the terminal 22a. <P>COPYRIGHT: (C)2004,JPO |
