| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wet etching treatment apparatus by which the etching distribution inside the face of the substrate to be treated can visually be observed. <P>SOLUTION: The wet etching treatment apparatus has a holding means of almost horizontally holding the substrate to be treated, an etching treatment liquid feeding means of feeding an etching treatment liquid to the surface of the held substrate to be treated, and a rotary driving means of rotating the holding means so as to rotate the held substrate to be treated inside the face. The wet etching treatment apparatus has a photographing means 7 of photographing the surface of the substrate to be treated at the optional point of time in which wet etching treatment is performed, and an observing means 15 of monitoring a picture photographed by the photographing means 7. <P>COPYRIGHT: (C)2004,JPO</p> |
