METHOD AND APPARATUS FOR PACKAGING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide an electronic component packaging method and an electronic component packaging apparatus that can sharply reduce thermal stress in a change in temperature occurring at the connection section of a soldering bump and can secure reliability in long-term connection. SOLUTION: When a sealing resin is filled between a circuit board and an electronic component, the ratio of distance (r) from the center section of the electronic component to the end section of the sealing resin to distance (s) from the center section to the bump (d=r/s) at the outermost periphery section should be 0.5≤d≤0.95 or less. COPYRIGHT: (C)2004,JPO