Manufacture procedure for stencil for circuit board assembly by welding metal stencil to pretensioned frame to tension stencil

摘要

Metal stencil (4) is secured non-releasably and directly to stable, pretensioned frame (2). Frame is pretensioned by frame sides (10) being curved inwards (12). Stencil is then tensioned by relaxing of the frame pretensioning in direction (36). Corners of stencil are cut off to prevent warpage of stencil. Openings forming stencil pattern are made before or after stencil is attached to frame. Independent claims for stencil made of laminated metal foil coated by plastic foil.