Production of a structure having a sharp tip or cutting edge comprises providing a semiconductor substrate on a surface having a recess with a tip section, side walls and a layer, and deforming the substrate in the region of the recess

摘要

Production of a structure having a sharp tip or cutting edge comprises providing a substrate (1), especially a semiconductor substrate, on a surface (2) having a recess (6) with a tip section (4) and side walls (5) and a layer (7) in the region of the recess, and obtaining a structure by deforming the substrate in the region of the recess. The layer is provided with an opening (10) before deformation in the region of the tip section. An Independent claim is also included for a cantilever beam produced by the above process.