发明名称 CYLINDRICAL MAGNETRON FOR SPUTTERING
摘要 PURPOSE: A cylindrical magnetron for sputtering is provided which is capable of effectively performing coating treatment by depositing metal particles sputtered from a metal material installed inside the magnetron onto the surface of a wire rod or a material to be worked having curved surface. CONSTITUTION: The cylindrical magnetron for sputtering is characterized in that a plurality of fixed grooves are concentrically formed with being spaced apart from each other in an equal distance at both ends of an inner side of a cylindrical support(11), first and second magnet groups(12) are formed by installing magnets in the fixed grooves in such a manner that a magnetic field is coherent to the magnets, a supporting cylinder(13) is installed in such a way that the magnets for forming the first and second magnet groups(12) are contacted with the outer surface of the supporting cylinder(13), a sputtering body(14) is installed at the inner side of the supporting cylinder(13), and a space is formed at the central part of the sputtering body(14) so that a material to be worked passes through the space.
申请公布号 KR20040017106(A) 申请公布日期 2004.02.26
申请号 KR20020049228 申请日期 2002.08.20
申请人 KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY 发明人 KIM, JAE HONG;RIUIJAE
分类号 C23C14/35;(IPC1-7):C23C14/35 主分类号 C23C14/35
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