| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which has a stacked package structure without restriction in each chip size of semiconductor chips mounted in a laminated state on a substrate. <P>SOLUTION: In this semiconductor device in which a plurality of semiconductor chips in a laminated state are mounted on the substrate, a sealing section is formed around a lower layer side semiconductor chip, and an upper layer side semiconductor chip is mounted on the sealing section. The upper layer side semiconductor chip is connected to conductors which are conducted with a substrate buried in the sealing section. In this semiconductor device, the sealing section is formed by sealing the lower layer side semiconductor chip and the conductors which are conducted with a substrate, and the upper layer side semiconductor chip is mounted on the sealing section. Then the upper layer side semiconductor chip is connected to the conductors. <P>COPYRIGHT: (C)2004,JPO |
