| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip for chip on chip connection with which a change of electrode pad arrangement is not newly required even if a size of the connected semiconductor chip is changed when a plurality of the semiconductor chips are chip-on-chip-connected to the same semiconductor chip, and positioning of the semiconductor chip and judgment of propriety after positioning are easy, and to provide a connection method of the chips. SOLUTION: An active region 4 where a logic circuit such as a digital signal processor is formed and a cross-like electrode pad 5 extended from a center part are disposed on a surface of the first semiconductor chip 1 arranged on a lower side. The electrode pad 5 is composed of a signal pad 5a transferring a signal and a dummy pad 5b which does not transfer the signal. The signal pad 5a is electrically connected to the active region 4 but the dummy pad 5b is not connected to it. COPYRIGHT: (C)2004,JPO
|
