| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that there is possibility that yield is deteriorated since impurity such as metallic oxide is adhered to the surface of wiring in a manufacturing process, and as a result, the adhesive force of the wiring and an inter-layer film formed on the upper face of the wiring is weakened, and the inter-layer film and an organic insulating film formed on this film are easily peeled from the wiring. SOLUTION: Wiring is formed, and the surface of wiring is exposed to acid so that impurity such as metallic oxide adhered to the surface of the wiring can be removed. Afterwards, an inter-layer film with aminosilane system compounds as materials is formed on the upper face of the wiring, and an organic insulating film is formed on the upper face of the inter-layer film. Thus, the wiring and the organic insulating film can be suitably adhered to each other, and possibility that the inter-layer film and the organic insulating film are peeled from the wiring can be reduced. COPYRIGHT: (C)2004,JPO
|
