| 摘要 |
PROBLEM TO BE SOLVED: To provide an open top type socket superior in a heat sink characteristics for a power semiconductor device and suitable for automation of removal of the semiconductor device. SOLUTION: There are provided a base 10 including a recessed portion 11 at a center thereof, a cover 20 movable in a direction approaching or separated from the base 10 and including an opening 21, a plurality of contacts 31, 32 including contact portions 31d, 32d fixed to the base 10, and a heat sink 40 mounted in the recessed portion 11 of the base 10. The semiconductor device is placed on the base 10 through the opening 21, with its lower surface in contact with the heat sink 40, the lower surface from which heat is dissipated. COPYRIGHT: (C)2004,JPO
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