| 摘要 |
PROBLEM TO BE SOLVED: To provide an image sensing device which is connected to a wiring unit through its side when the image sensing device is connected to the case of a camera or the like and is capable of keeping a package design high in flexibility, and to provide a method of manufacturing the same. SOLUTION: The method of manufacturing the image sensing device comprises a first process of forming a plurality of image sensing elements 100 on the front face of a semiconductor substrate, a second process of bonding a light transmitting member 200 to the front of the semiconductor substrate as the transparent member 200 is confronted with the light receiving regions of the image sensing elements 100 through a gap, a third process of bonding a support substrate 701 to the rear of the semiconductor substrate, a fourth process of forming a through groove 108 which is equipped with a conductive inner wall and provided to separating regions and their vicinities to separate the image sensing elements on the semiconductor substrate as penetrating through the semiconductor substrate before or after the third process is performed, and a fifth process of separating the bonded body obtained through the above bonding processes into the unit solid state image sensing elements by the separating regions DC as side wall wiring units 109 formed of a part of the through groove whose inner wall is conductive are left. COPYRIGHT: (C)2004,JPO
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