SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF AND ADHESIVE SHEET FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a surface mounted type semiconductor device in a leadless structure capable of thinning.

SOLUTION: The manufacturing method of the semiconductor device comprises: a process (1) of forming a plurality of conductive parts 40 partially on an adhesive material layer 31 on an adhesive sheet 30 having a base material layer 32 and the adhesive material layer 31; a process (2) of fixing at least one semiconductor element 10 where an electrode is formed onto the adhesive material layer 31, such that the side where the electrode is not formed of the semiconductor element 10 is on the side of the adhesive material layer 31; a process (3) of electrically connecting a plurality of the conductive parts 40 and the electrode of the semiconductor element 10 by a wire 60; a process (4) of sealing the semiconductor element 10 or the like with sealing resin and forming the semiconductor device on the adhesive sheet 30; and then a process (5) of separating the adhesive sheet 30 from the semiconductor device.

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