| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor device which can obtain thin flip-chip type semiconductor packages while preventing damage on the semiconductor chips and adhesion of underfill to the rear surfaces of semiconductor chips. SOLUTION: This method comprises a reinforcing film adhering process to adhere a reinforcing film 2, to reinforce mechanical strength of a semiconductor chip 5, to the surface opposite to the surface where electric circuits of a semiconductor chip 5 are formed; and a flip-chip bonding process to electrically and mechanically connect the semiconductor chip 5 and wiring substrate 8, under the condition that the surface where the electric circuits of the semiconductor chip 5 are formed is provided opposite to the wiring substrate 8. In the flip-chip bonding process, the semiconductor chip is connected to the wiring substrate 8 under the condition that the reinforcing film is adhered to the surface opposite to the surface where electric circuits of the semiconductor chip are formed. COPYRIGHT: (C)2004,JPO
|
