发明名称 DEVICE FOR CUTTING GATE OF MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a device for cutting the gate of a molded product which increases the precision of a gate cut area of a finished product part by letting loose a stress generated during cutting the gate of a resin molded product and efficiently cuts the gate part of the resin molded product with high positional precision and further ensures the secure cutting between the finished product part and a runner part of the resin molded product. SOLUTION: The device for cutting the gate of a molded product is equipped with a molded product retaining member consisting of a runner retaining part and a finished product retaining part, a pair of cutting blades which cut the resin molded product at the gate part and a finished product gripping member which grips the finished product part retained by the molded product retaining member and moves the finished product part to the cutting blade side. The runner retaining part of the molded product retaining member is movable to the finished product retaining part in a direction where the runner retaining part approaches and becomes apart from the cutting blade. In addition, the runner retaining part is urged so that it is always urged to a neutral position between the two directions by the elastic force of an elastic member and absorbs a stress generated during cutting the gate following the elastic deformation of the elastic member. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004058293(A) 申请公布日期 2004.02.26
申请号 JP20020216259 申请日期 2002.07.25
申请人 STAR SEIKI CO LTD 发明人 WATANABE TAKEYOSHI;MIZUNO KOJI;SHUDO HIROKI;KAMATA NOBUYUKI;YAMAGUCHI SHUICHI;ICHIHARA HIROYUKI;IWASAKI KOJI;KANO HIDEYUKI
分类号 B29C45/38;(IPC1-7):B29C45/38 主分类号 B29C45/38
代理机构 代理人
主权项
地址