| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device with high mounting property and a manufacturing method therefor, a circuit board, and an electronic apparatus. <P>SOLUTION: The method for manufacturing the semiconductor device includes a process of decreasing the height of at least one of a plurality of external terminals 16 which are electrically connected to a semiconductor chip 20 mounted on one surface of the substrate 10 and sealed with resin, and provided in a plurality rows and a plurality of columns on the other surface of the substrate. <P>COPYRIGHT: (C)2004,JPO |
