| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology which can assure the service life of solder joints of an electronic device. <P>SOLUTION: The service life of the solder joints of the electronic device is assured by preventing solder from wetting and going up to a lower portion of a semiconductor chip (semiconductor element). In order to prevent the solder from wetting and going up, joints of a substrate are located outside an insulating film so that the insulating film which is a base member of a TCP semiconductor device, and the joints of the substrate may not overlap each other. Alternatively, parts of leads which are opposite to the semiconductor chip are covered with a sealing resin, or leads in the lower portion of the semiconductor chip are coated with resin. <P>COPYRIGHT: (C)2004,JPO |
