| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an optically coupled semiconductor device which is superior in reliability, can be miniaturized and can be manufactured by a simple process, and to provide a manufacturing method of the device. <P>SOLUTION: The device is provided with a laminated wiring board 1 formed of a first wiring board 2 having an opening part 2a and a second wiring board 3 laminated on the first wiring board, a light emitting element 5 loaded on a surface of the second wiring board in accordance with the opening part, switching elements 14 loaded on the laminated wiring board, a light receiving element 8 in which a light receiving part 8a is confronted with the opening part of the first wiring board and which is arranged to cover the opening part, a first translucent resin 10 in a solid shape which is arranged in the light receiving element to cover the light receiving part, a second translucent resin 7 with which the opening part of the first wiring board is filled so that a surface is brought into contact with the first translucent resin, and a sealing resin disposed on the surface of the first wiring board so that it covers the first translucent resin and the second translucent resin. <P>COPYRIGHT: (C)2004,JPO</p> |
