| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide excellent electric connection between two conductive layers by suppressing resistance on conduction between them or the like in a contact hole on a substrate device. <P>SOLUTION: The substrate device is provided with a polysilicon film (202), an insulating layer (210) and wiring (212) successively formed on it, and the contact hole (210C) perforated in the insulating layer for electrically connecting the polysilicon film and the wiring on a substrate. The side wall of the contact hole and the surface of the polysilicon film connected to the contact hole cross at right angles. <P>COPYRIGHT: (C)2004,JPO</p> |
