| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer-heating device which is superior in the temperature uniformity of a mounting surface of a soaking plate, even if the soaking plate installed in a case is fixed to a support member or the like, and is free of dispersion in the temperature distribution of a wafer W. SOLUTION: The wafer-heating device has a soaking plate, which has a resistance heater in one major surface of a plate-like ceramics body and a wafer-heating surface in the other major surface, a feed terminal for supplying power to the resistance heater, a case connected to the soaking plate to enclose the feed terminal, a support member for fixing the case and a stress-absorbing member for preventing the deformation of the case, between the outer peripheral surface of the case and the support member. COPYRIGHT: (C)2004,JPO
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