| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer marking system which is capable of quickly printing a mark on a defective element on a work, such as a semiconductor wafer or the like, and easily maintained as keeping high in accuracy of printing position. SOLUTION: The wafer marking system is equipped with a printing means 201 provided with a printing head 204 movable in one direction on the element forming surface of the work 101 as an object of inspection. The printing head 204 is positioned at a required printing position on the element forming surface of the work 101 as a mounting pad 102 is moved in a direction perpendicular to the direction of movement of the mounting pad 102. The printing means 201 is equipped with a position target 207 for correcting it for a mounting error, and a detecting means 203 for detecting the position target 207 is provided so as to interlock with the mounting pad 102. COPYRIGHT: (C)2004,JPO
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