MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MOUNTING EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of manufacturing the semiconductor device of both-surface mounting with a short unit time, and semiconductor mounting equipment used for it. SOLUTION: At the time of manufacturing the semiconductor device for which a semiconductor element is mounted on both surfaces of a circuit board, in the state of attaching the circuit board 4 to a stage 11, the semiconductor elements 1a and 1b are mounted on both upper and lower surfaces of the circuit board 4 by the same processing unit by loading heads 12a and 12b respectively disposed on both upper and lower sides of the stage 11. COPYRIGHT: (C)2004,JPO