| 摘要 |
PROBLEM TO BE SOLVED: To increase a heat dissipating area without enlarging a whole of a device. SOLUTION: A heat dissipating fin 12 is formed in a shape made by winding a strip plate material vortically and is provided with a plurality of holes 13 penetrating in the direction of thickness of the heat dissipating fin 12. Consequently, the heat dissipating area can be increased without enlarging the whole of the device 1. Further, as there is provided a plurality of holes 13 penetrating in the direction of thickness of the heat dissipating fin 12, a heat transfer coefficient increasing effect (a tip efficacy) in edges of cut and raised pieces 14 and growth of a thermal boundary layer caused by a turbulent flow of a cooling air when the cooling air passes through each of the holes 13 can be restrained. Consequently, the heat transfer coefficient between the heat dissipating fin 12 and the cooling air can be increased, so that a cooling capability of the cooling device 1 can be increased. COPYRIGHT: (C)2004,JPO
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