| 摘要 |
The invention relates to an acid electrolyte for depositing tin-copper alloys. Said electrolyte comprises one or more alkylsulfonic acids and/or alkanolsulfonic acids, one or more soluble tin(II) salts, one or more soluble copper(II) salts, and one or more organic sulfur compounds having one or more thioether functions and/or ether functions of general formula -R-Z-R'-(R and R' are the same or different non-aromatic organic radicals, and Z represents S or O). The invention also relates to a method, which involves the use of the electrolyte, to the coating obtained using said method, and to the use of the electrolyte for coating electronic components.
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