| 摘要 |
This invention is a method for making a thin, flat metal membrane of palladium or palladium/copper alloy. It involves sputtering the metal onto a flat surface of a substrate under conditions such that a deposited film is essentially free of compressive and tensile stresses. The membrane that results upon removal of the film from the substrate, as by dissolving a parting layer therebetween, does not curl up. |
