发明名称 |
Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support |
摘要 |
<p>A chuck for a plasma processor comprises a temperature-controlled base, a thermal insulator, a flat support, and a heater. The temperature-controlled base has a temperature below the desired temperature of a workpiece. The thermal insulator is disposed over the temperature-controlled base. The flat-support holds a workpiece and is disposed over the thermal insulator. A heater is embedded within the flat support and/or disposed on an underside of the flat support. The heater includes a plurality of heating elements that heat a plurality of corresponding heating zones. The power supplied and/or temperature of each heating element is controlled independently.</p> |
申请公布号 |
EP1391140(A1) |
申请公布日期 |
2004.02.25 |
申请号 |
EP20020723949 |
申请日期 |
2002.04.23 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
BENJAMIN, NEIL;STEGER, ROBERT |
分类号 |
C23F4/00;H01L21/687;H01L21/00;H01L21/02;H01L21/3065;H01L21/683;(IPC1-7):H05B3/16;C23C16/00;H05B3/68;H05B3/44 |
主分类号 |
C23F4/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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