SEMICONDUCTOR DIE PACKAGE HAVING MESH POWER AND GROUND PLANES
摘要
A cluster grid array semiconductor die package and mating socket provide electrical connection between one or more semiconductor dies housed within the die package and substrate, such as a printed circuit board, on which the mating socket is mounted. The die package and the mating socket may be easily connected and disconnected. The die package may include power and ground planes built into and distributed within the housing of the die package.
申请公布号
EP1390979(A2)
申请公布日期
2004.02.25
申请号
EP20020721115
申请日期
2002.02.25
申请人
SILICON BANDWIDTH INC.
发明人
CRANE, STANFORD, W., JR.;JEON, MYOUNG-SOO;OGATA, CHARLEY, TAKESHI;WANG, TON-YONG;CANGELLARIS, ANDREAS, C.;SCHUTT-AINE, JOSE