Assembly of power semiconductors with a compensation layer facing the heatsink

摘要

Structure consists of a semiconducting chip (3) with a solderable substrate surface (3b) beneath the chip. An expansion layer (9) of a metal textile is soldered between the chip and a metal surface (1b'') of a metal substrate (1a,1b) to compensate for different thermal expansions of the chip relative to the metal surface. Independent claims are also included for the following: a power electronics device with at least one flat semiconductor and the use of a metal textile compensating layer or an expansion layer of metal fibers.