发明名称 |
Orientation insensitive thermosiphon assembly for cooling electronic components |
摘要 |
A thermosiphon assembly for dissipating heat generated by an electronic component using a working fluid is disclosed. The assembly includes an evaporator having a front face, a rear face, and a peripheral wall extending between the front face and the rear face and being arcuate. A heat block contacts the front face for transferring generated heat from the electronic component to the working fluid to vaporize the working fluid. A condenser is in fluid communication with the chamber and connected to the rear face for condensing the vaporized working fluid back to a liquid. The assembly further includes an acute angle between the front face and the peripheral wall such that the chamber extends upwardly at an angle from the front face to the rear face to ensure complete coverage of the heat block with the cooling fluid in any position between horizontal and vertical.
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申请公布号 |
US6695039(B1) |
申请公布日期 |
2004.02.24 |
申请号 |
US20030374349 |
申请日期 |
2003.02.25 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
REYZIN ILYA;BHATTI MOHINDER SINGH;JOSHI SHRIKANT MUKUND;GHOSH DEBASHIS |
分类号 |
F28D15/02;H01L23/427;H05K7/20;(IPC1-7):F28D15/00 |
主分类号 |
F28D15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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