Semiconductor device and photonic semiconductor device applying the semiconductor device

摘要

A semiconductor device and a photonic semiconductor device are disclosed wherein, if w is the thickness of a metal electrode layer covering a contact layer and current-unfed regions, D denotes the thickness of a plating layer on the metal electrode layer, the boundary between the contact layer and any one of the current-unfed regions is an origin, a direction from the origin into the device interior is a positive direction, and a direction from the origin toward any one of device facets is a negative direction, then a distance d between the origin and each facet of the plating layer satisfies (d/w)[1-w/(w+D)]<20.