摘要 |
A method and apparatus for sealing a package over/around a circuit is presented. A pressurized directional flow of plasma is applied between metal bonding edges of the package and a metal surface surrounding circuitry to be enclosed in the package. During the application of plasma between the bonding surfaces, a bonding devices direct contact fusion/diffusion bonds the metal bonding edges of the package to the metal bonding surface surrounding the circuitry to be enclosed.
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