| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device which can improve the mounting efficiency of board mounting. SOLUTION: This semiconductor device has a semiconductor chip (7), an insulation layer (8) which is formed on the main surface of the semiconductor chip (7) except regions on which a plurality of electrode pads (6) are formed, a plurality of contact pads (10) arranged on the insulation layer (8), a wiring layer (9) which is electrically connected with at least one of the plurality of electrode pads (6) and with at least one of the contact pads (10) to perform re-wiring connection, an insulating resin layer (11) which is formed on the main surface of the semiconductor chip (7) except regions on which the plurality of contact pads (10) are formed, protruding electrodes (12) formed on the plurality of contact pads (10) respectively, and an underfill material layer (13) formed on the insulating resin layer (11) so as to expose the tip parts of the protruding electrodes (12).</p> |
