| 摘要 |
<p>A plurality of electrical devices, such as RFID tags, that each include a die having one or more connecting pads, are produced. Dies are transferred from a wafer directly to substrates, or from the wafer to one or more intermediate surfaces before being transferred to the substrates. Dies can be transferred between surfaces using an adhesive surface mechanism and process. Dies can be alternatively transferred between surfaces using a punching mechanism and process. Dies can be alternativley transferred between surfaces using a multi-barrel die collet mechanism and process. Alternatively, a die frame is formed. Furthermore, dies are transferred using the die frame.</p> |
