ALIGN STRUCTURE OF SHADOW RING AND DEPOSITION RING OF SPUTTERING APPARATUS

摘要

PURPOSE: An align structure of a shadow ring and a deposition ring of a sputtering apparatus is provided to exclude the use of a dummy wafer by making the align structure of an unevenness type, and to prevent the shadow ring from being separated by improving the firmness of the align structure. CONSTITUTION: The shadow ring(10) is located on a chamber to prevent a wafer chuck from being etched. The deposition ring(30) determines the placement position of the wafer, installed under the shadow ring while being capable of moving up and down. A protrusion(12) is formed on one of the confronting surfaces of the shadow ring and the deposition ring. A concave groove(32) into which the protrusion is inserted is formed on the other of the confronting surfaces.