发明名称 MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD FOR INSERTING OPTICAL FIBER INTO MULTI-LAYER PRINTED CIRCUIT BOARD
摘要 PURPOSE: A multi-layer printed circuit board and a method for inserting an optical fiber into the multi-layer printed circuit board are provided to prevent the chemical and thermal damage by simultaneously layering at least one optical substrate and a printed circuit board. CONSTITUTION: A substrate(100) covered with a cooper foil on a surface of a dielectric substrate layer(20) is provided. At least one groove(30) is formed through a router bit process in order to insert an optical fiber(60) into the dielectric substrate layer(20) of the substrate(100). A bonding liquid(50) is applied on an inner wall of the groove(30). After the optical fiber(60) is inserted into the groove(30) applied with the bonding liquid(50), an optical substrate(200) is formed by adhering and fixing the optical fiber(60). At least one printed circuit board(300) is layered on upper and lower ends of the optical substrate(200).
申请公布号 KR20040016329(A) 申请公布日期 2004.02.21
申请号 KR20020048603 申请日期 2002.08.16
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHO, YEONG SANG;KIM, YEONG U;LIM, GYU HYEOK;YANG, DEOK JIN
分类号 H05K3/00;G02B6/36;G02B6/43;H05K1/02;(IPC1-7):H05K3/00 主分类号 H05K3/00
代理机构 代理人
主权项
地址