| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-seal molding apparatus with a low consumption of resin. SOLUTION: The resin-seal molding apparatus is characterized in that it is constituted by arranging a primary ejector plate 50, equipped with a runner lock pin 53a and 53c for performing a gate break, and the second ejector plate 60 for pushing out a molded article 18 from a cavity 33 on the outer face of an upper die 40. COPYRIGHT: (C)2004,JPO |
