发明名称 SANDWICH MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a sandwich molding method which can secure a sufficient thickness of a core layer while having a wide selective width for the class of a resin even for a sandwich molded product of a thin wall thickness, and can sufficiently secure the wall thickness of the skin layer corresponding to a gate front surface part of the cavity surface of the molded product. SOLUTION: The sandwich molding method in which a resin becoming a skin layer through the same sprue and a resin becoming a core layer are continuously injected into the cavity, is characterized in that a resin cooling speed of a gate front surface part of the cavity surface is made quicker than the resin cooling speed of a peripheral part of the gate front surface part. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004050622(A) 申请公布日期 2004.02.19
申请号 JP20020211099 申请日期 2002.07.19
申请人 SEKISUI CHEM CO LTD 发明人 KANEMITSU YASUJI;TOMINAGA SATOSHI
分类号 B29C45/26;B29C45/16;B29C45/56;B29C45/78;B29L9/00;(IPC1-7):B29C45/16 主分类号 B29C45/26
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