发明名称 HEAT TREATMENT DEVICE FOR HEATING APPARATUS, HEAT EXHAUST PIPE, BUILDING EQUIPPED WITH HEAT TREATMENT DEVICE, PROGRAM FOR HEAT TREATMENT DEVICE OF EXOTHERMIC APPARATUS, AND PROGRAM STORAGE MEDIUM FOR HEAT TREATMENT DEVICE OF HEATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To achieve heat exhaust higher than heat exhaust capacity by diffusion or connection by providing a forcible air flow means installed near a connection part of a part with low heat exhaust efficiency and a part with high heat exhaust efficiency, and to minimize energy used for improving the efficiency and applied from the outside. SOLUTION: The heat generated in the heating apparatus 101 reaches a horizontal pipe 102. A forcible air flow means 103 is installed near a connection part of a horizontal pipe 102 and an L shaped pipe vertical part 104 wherein the heat exhaust efficiency varies to be high, and thereby the heat in the horizontal pipe 102 is effectively made to flow into the L shaped pipe vertical part 104. Further, an air flow forcible means 107 is installed near a connection part of an L shaped pipe horizontal part 105 and a vertical pipe 108 wherein the heat exhaust efficiency varies to be high, and thereby the heat in an L shaped pipe 106 is smoothly conducted to the vertical pipe 108. The air flow forcible means is installed only on a required part in a view of heat exhaust efficiency in heat conduction. Thus, effective heat conduction can be achieved with small power consumption. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004053175(A) 申请公布日期 2004.02.19
申请号 JP20020212985 申请日期 2002.07.22
申请人 SONY CORP 发明人 ADACHI SHIZUO
分类号 F24F7/007;F24F7/06;(IPC1-7):F24F7/007 主分类号 F24F7/007
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