| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper paste and a wiring substrate using the same capable of forming a plating film without producing any glass protrusion on the surface of a conductive layer and any defect in a fine wiring pattern in the wiring substrate using copper in the conductive layer. SOLUTION: The wiring substrate having a conductive layer within which inorganic particles having an average diameter of 2μm or less are scattered is obtained by the application of the copper paste, containing copper powder, an organic vehicle and ceramic particles having a diameter of 100 nm or less and which are not made to be vitrified by sintering, to a ceramic green sheet and by the baking thereof. COPYRIGHT: (C)2004,JPO
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