发明名称 METHOD OF RECYCLING SUBSTRATE PLACEMENT MEMBER
摘要 PROBLEM TO BE SOLVED: To provide a method of recycling a substrate placement table, by which a substrate placement member can be recycled without being disposed and hence no inconvenience by the disposal is caused. SOLUTION: The substrate placement member is a location to place a substrate W thereon in substrate processing equipment 1 for processing the substrate W, and comprises a base member, an electrostatic chuck for chucking the substrate which is located on the base member, and an organic adhesive layer for bonding the base member and the electrostatic chuck together. In recycling the substrate placement member, the substrate placement member is unmounted from the substrate processing equipment when it is replaced with a new one (STEP 1), and the adhesive layer is removed to separate the base member and the electrostatic chuck (STEPS 2 and 4), and then the base member and/or the electrostatic chuck is recycled (STEP 5). COPYRIGHT: (C)2004,JPO
申请公布号 JP2004055815(A) 申请公布日期 2004.02.19
申请号 JP20020211051 申请日期 2002.07.19
申请人 TOKYO ELECTRON LTD 发明人 SUZUKI KIMITAKA
分类号 H01L21/3065;H01L21/205;H01L21/68;H01L21/683;(IPC1-7):H01L21/68;H01L21/306 主分类号 H01L21/3065
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