| 摘要 |
PROBLEM TO BE SOLVED: To reduce the manufacturing cost of a precipitated substrate by reducing the electric power consumption for preheating. SOLUTION: This apparatus is arranged in a precipitating mechanism 10 for dipping for a prescribed time into molten metal 15 after preheating the substrate surface 114a to manufacture a semi-conductive substrate 2 as the precipitated material solidified and grown in the molten metal 15 on the substrate surface 114a. Then, this apparatus is provided with a carbon-made member 114 for precipitating, formed on the substrate surface 114a and a forming heat insulating bodies 115 having the heat-insulation, and interposed between the member 114 for precipitation and the precipitating mechanism. COPYRIGHT: (C)2004,JPO
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