发明名称 CHIP TRANSFER APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD USING THE CHIP TRANSFER APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a chip transfer apparatus capable of eliminating an additional labor and work upon transferring a chip with suppressed equipment investment. SOLUTION: There is provided a controller 19 for controlling the operation of a chip transfer mechanism section 15. The controller 19 executes a reversible control sequence such that in a chip storing mode the chip transfer mechanism section 15 transfers a chip from a line input wafer ring 6 set to an inloader section 2 to a chip storing tray 11 set to an outloader section 3, and in a line input mode the chip transfer mechanism section 15 transfers a chip 7 from the tray 11 set to the outloader section 3 to the wafer ring 6 set to the inloader section 2. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004056041(A) 申请公布日期 2004.02.19
申请号 JP20020214964 申请日期 2002.07.24
申请人 RENESAS TECHNOLOGY CORP 发明人 KATO SUNAO
分类号 H01L21/677;H01L21/50;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/677
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