Heat pipe diode assembly and method

摘要

A heat pipe diode assembly is provided that includes at least two heat pipes and at least two working fluid reservoirs, with one working fluid reservoir arranged in fluid communication with each the heat pipes. A cold finger is arranged in thermal engagement with each of the heat pipes. A device to be cooled is arranged in thermal engagement with a portion of each of the heat pipes. Another embodiment provides a heat pipe diode assembly formed in accordance with the invention includes three heat pipes and six working fluid reservoirs, with two working fluid reservoirs arranged in fluid communication with each of the three heat pipes. Three cold fingers are provided, with one arranged in thermal engagement with each of the three heat pipes. A device to be cooled is arranged in thermal engagement with a portion of each of the three heat pipes. Methods are also provided for operation of a heat pipe diode assembly.