| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is constituted so that stud bumps are formed easily on a semiconductor chip, even if the chip has a very small area of about 2×2 mm<SP>2</SP>or smaller. <P>SOLUTION: This semiconductor device has a substrate 10x, which supports the semiconductor chip 14 and has a larger area (for example, 3×3 m<SP>2</SP>) than the chip 14 has, and the semiconductor chip 14 the back of which is fixed on the substrate 10x and which is provided with the stud bumps 26. The stud bumps 26 are formed, in a state where the chip 14 is supported on the substrate 10x. <P>COPYRIGHT: (C)2004,JPO |
