发明名称 |
Thermoplastic resin composition, molded product using the same and transport member for electric and electronic parts using the same |
摘要 |
The present invention relates to a thermoplastic resin composition comprising a thermoplastic resin and hollow carbon fibrils dispersed in the thermoplastic resin, the hollow carbon fibrils being present in an amount of 0.1 to 20% by weight based on the total weight of the composition, comprising independent fibrils and agglomerated fibrils, and having such a dispersing condition, when represented by indices based on the measurement of transmission electron microphotograph, that the ratio of the independent fibrils to the agglomerated fibrils lies within the range of 8/92 to 40/60 and the independent fibrils have an average length of 20 to 200 nm.
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申请公布号 |
US2004034140(A1) |
申请公布日期 |
2004.02.19 |
申请号 |
US20030464095 |
申请日期 |
2003.06.17 |
申请人 |
MITSUBISHI ENGINEERING-PLASTICS CORP. |
发明人 |
KURASAWA YOSHIHIRO;OBAYASHI NAOTO;TAKAGI KIYOJI;MURAMATSU SHIGERU |
分类号 |
C08K7/24;(IPC1-7):C08L67/00;C08L71/00;C08L77/00 |
主分类号 |
C08K7/24 |
代理机构 |
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地址 |
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