| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board that is capable of reducing an area needed for mounting a plurality of electronic components such as an IC chip or the like, and coping with miniaturization and high performance. <P>SOLUTION: The multilayer wiring board 1 comprises a base lamination unit 2 having a front side 6 and a back side 8, and including a plurality of insulation layers 3, 4 and 5 and wiring layers 10, 12 formed therebetween; an upper insulation layer 20 having a cavity 19 that is laminated on the surface 6 of the lamination layer 2 and has a small opening diameter; an upper insulation layer 30 having a cavity 39 that is laminated on the surface 21 of the upper insulation layer 20 and has a large opening diameter; and wiring layers 18, 29 that are formed between the base lamination unit 2 and the upper insulation layer 20, and between the upper insulation layer 20 and, the upper lamination layer 30, wherein connection terminals 16, 28 and 38 connected to electronic components such as an IC chip or the like are formed on the surfaces 21, 31 of the upper insulation layers 20, 30 and on the surface 6 of the base lamination unit 2 which are exposed in a plan view. <P>COPYRIGHT: (C)2004,JPO</p> |
