| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a small semiconductor package which is reduced in size and thickness, improved in density, reduced in cost, protected against cracks so as to be superior in reliability, and is capable of reducing the number of vent holes or eliminating them. <P>SOLUTION: A semiconductor mounting board is equipped with a support, mounted with many semiconductor chips on its one surface. The support contains an insulating layer formed on its one surface, where the semiconductor chips are mounted and a carrier layer which is formed on its other surface opposite to its one surface, where the insulating layer is formed and can be removed, after the semiconductor chips are mounted. <P>COPYRIGHT: (C)2004,JPO</p> |
