| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component wherein an electronic component element is joined with a base board by a face-down method and a resin seal layer is provided to seal a space between the both that is structured to surely suppress a resin from intruding to a function area of the electronic component element. SOLUTION: In the electronic component, a surface acoustic wave element 3 is joined with the base board 2 by the face-down method from a first principal side of the base board 2 on which a function electrode 5 is provided, the resin seal layer 10 seals the gap A between the base board 2 and the surface acoustic wave element 3, a second dam member 9 of a frame shape is provided to outside of a part, to which an IDT electrode 5 acting like the function electrode of the surface acoustic wave element 3 is provided, at the inside of the first dam member 8 in order to prevent the resin configuring the resin seal layer 10 from intruding the inward of the resin in addition to the first dam member 8. COPYRIGHT: (C)2004,JPO
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