发明名称 |
FLOORING LAYING STRUCTURE, FLOORING METHOD, REPAIRING METHOD, AND FLOORING MATERIAL |
摘要 |
PROBLEM TO BE SOLVED: To provide a flooring structure possible to be repaired by easily peeling the flooring material when re-flooring without lowering flooring workability, and to provide a flooring method, a repairing method and a flooring material. SOLUTION: The flooring floor 10 has the laying structure provided with a non-peeled release liner 3 interposed between an adhesive layer 2 and a floor bedding 4 in an intermediate part in the longitudinal direction of the flooring material 1 to form a non-adhesive layer B. When peeling the flooring material 1 laid with this structure, a suction device 5 is used to pull the non-adhesive layer B for separation from the floor bedding 4. An appropriate tool is inserted into the peeled part to peel the flooring material 1 from the floor bedding 4. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004052453(A) |
申请公布日期 |
2004.02.19 |
申请号 |
JP20020213910 |
申请日期 |
2002.07.23 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
TAKEBE YOSHIYUKI;NAKAGAWA MICHIYA |
分类号 |
E04F15/00;(IPC1-7):E04F15/00 |
主分类号 |
E04F15/00 |
代理机构 |
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