| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for processing a substrate which can supply a cleaning liquid only to a required region of the substrate, without scattering the liquid, can thereby maintain clean atmosphere in a chamber and can reduce the amount of the cleaning liquid used. SOLUTION: The apparatus for processing the substrate includes rotation holding mechanisms 21a, 21b, 21c and 21d, each for substantially horizontally holding and rotating the substrate; and a cleaning liquid supply mechanism 23 for supplying the cleaning liquid L toward a region B to be cleaned of the substrate at a flow rate of at least 0.1 m/s or higher, by opening a cleaning liquid discharge port directed toward the radiating direction directed from an inside of the substrate toward the peripheral edge at an elevation angle of 45°or smaller, from the surface of the substrate to at least one of a front surface and a rear surface of the substrate. COPYRIGHT: (C)2004,JPO
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